RESIN COMPOSITION FOR A NO-FLOW UNDERFILL CONTAINING A THERMALLY DEPOLYMERIZABLE RESIN CAPABLE OF INDUCING THE DEPOLYMERIZATION OF THE RESIN COMPOSITION, AND A NO-FLOW UNDERFILL FILM USING THEREOF

摘要

PURPOSE: A resin composition for a no-flow underfill, and a no-flow underfill film using thereof are provided to secure the excellent crack resistance of the underfill film, and to rapidly hardening the composition at the soldering process temperature.;CONSTITUTION: A resin composition for a no-flow underfill contains the following: 100 parts of epoxy resin by weight; 5~80 parts of thermally depolymerizable resin by weight containing an acid catalyst; 1~110 parts of hardener and curing accelerator by weight; 3~80 parts of modifying thermoplastic resin by weight; and 0.01~0.10 parts of fusion material by weight.;COPYRIGHT KIPO 2011