首页> 外文OA文献 >Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications

【2h】

Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications

机译：柔性包装应用中SN / IN / BI焊料无流量底部填充的动力学和化学式行为

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Yong-Sung Eom; Ji-Hye Son; Hyun-Cheol Bae; Kwang-Seong Choi; Jin-Ho Lee;
展开▼
作者单位

展开▼
年度 2016
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications [J] . Yong-Sung Eom, Ji-Hye Son, Hyun-Cheol Bae, ETRI journal . 2016,第6期

机译：软包装应用中锡/铟锡/铋焊料无流动底部填充剂的固化动力学和化学流变行为
2. Development of new no-flow underfill materials for both eutectic Sn-Pb solder and a high temperature melting lead-free solder [J] . Haiying Li, Johnson A., Wong C.P. IEEE Transactions on Components and Packaging Technologies . 2003,第2期

机译：开发用于共晶Sn-Pb焊料和高温熔融无铅焊料的新型无流动底部填充材料
3. Development of a high curing latency no-flow underfill with self-fluxing ability for lead-free solder interconnects [J] . Yangyang Sun, Zhuqing Zhang, C.P.Wong Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2004,第1期

机译：高固化潜伏期，具有自熔能力的无流动底部填充剂的开发，用于无铅焊料互连
4. Kinetic modeling of no-flow underfill cure and its relationship to solder wetting and voiding [C] . Hurley J.M., Berfield T., Ye S., Electronic Components and Technology Conference, 2002. Proceedings. 52nd . 2002

机译：无流动底部填充固化的动力学模型及其与焊料润湿和空隙的关系
5. Study on the curing process of no-flow and wafer level underfill for flip-chip applications. [D] . Zhang, Zhuqing. 2003

机译：研究用于倒装芯片的非流动和晶圆级底部填充的固化工艺。
6. Improved electrical and thermo-mechanical properties of a MWCNT/In–Sn–Bi composite solder reflowing on a flexible PET substrate [O] . Sang Hoon Kim, Min-soo Park, Joon-Phil Choi, -1

机译：改进了在柔性PET基板上回流的MWCNT / In-Sn-Bi复合焊料的电和热机械性能
7. Sigmoidal Chemorheological Models of Chip-Underfill Materials Offer Alternative Predictions of Combined Cure and Flow [O] . Brian J. Love, Fabien Teyssandier, Yang Y. Sun, 2008

机译：芯片底部填充材料的Sigmoid Chemorheological模型提供了组合治愈和流量的替代预测

Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications

著录项

引文网络

相似文献

相关主题

期刊订阅