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Methods of fabricating P-I-N diodes, structures for P-I-N diodes and design structure for P-I-N diodes

机译:P-I-N二极管的制造方法,P-I-N二极管的结构和P-I-N二极管的设计结构

摘要

Methods of fabricating P-I-N diodes, structures for P-I-N diodes and design structure for P-I-N diodes. A method includes: forming a trench in a silicon substrate; forming a doped region in the substrate abutting the trench; growing an intrinsic epitaxial silicon layer on surfaces of the trench; depositing a doped polysilicon layer to fill remaining space in the trench, performing a chemical mechanical polish so top surfaces of the intrinsic epitaxial silicon layer and the doped polysilicon layer are coplanar; forming a dielectric isolation layer in the substrate; forming a dielectric layer on top of the isolation layer; and forming a first metal contact to the doped polysilicon layer through the dielectric layer and a second contact to the doped region the dielectric and through the isolation layer.
机译:P-I-N二极管的制造方法,P-I-N二极管的结构和P-I-N二极管的设计结构。一种方法包括:在硅衬底中形成沟槽;在衬底中形成与沟槽邻接的掺杂区;在沟槽的表面上生长本征外延硅层;沉积掺杂的多晶硅层以填充沟槽中的剩余空间,进行化学机械抛光,以使本征外延硅层和掺杂的多晶硅层的顶面共面;在基板中形成电介质隔离层;在隔离层的顶部上形成电介质层;通过电介质层与掺杂的多晶硅层形成第一金属接触,并通过电介质并通过隔离层与掺杂区域形成第二接触。

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