DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, AND THE SUBASSEMBLIES FORMED THEREWITH

摘要

A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about (15) to about (65) volume percent of a dielectric filler; and about (35) to about (85) volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.