PRESSURE CONTACT SPRING FOR A CONTACT ARRANGEMENT IN A POWER SEMICONDUCTOR MODULE

摘要

The inventive pressure contact spring (3) comprises two contacting areas (31, 32) for contacting metallized contact points (1, 2), whereby one contacting area has a contact tip (31). A compressing area (33) is placed between the contacting areas. The contact tip is rounded with an outside radius. In the event of a high spring force, the rounded contact tip automatically penetrates the metallization of the contact point, but only slightly.