Solder ball mount apparatus which improves productivity and method of solder ball mount using the same

摘要

The present invention relates to a solder ball mounting device for attaching the solder ball to the substrate for the production of a semiconductor device . A solder ball mounting device of the present invention, the substrate for attaching the solder balls, and transfer means for transferring in a first direction, and sequentially comprising a first ball and second ball mounting unit mounting unit formed along the first direction, wherein first ball mounting unit while moving along the second direction different from the first direction of tool movement along the flux and the second direction for applying the flux to the substrate for attaching the solder balls to the substrate a first view the mounting tool including, the second ball mount unit comprises a second ball mounting tool for mounting a solder ball on the substrate which has been transferred after the second moving in the direction of the flux by the flux coating tool. ; In accordance with the present invention, it is possible to greatly improve the productivity of the process per cycle flux tool by shortening the waiting time for the solder ball mounting process time can be significantly reduced compared with the conventional because the equipment compared to the prior art. May also be used up to only a single ball mount tools used for the sample production, and can be used for mass production and run all of the two tools, so that the ball mount is wider range of equipment is available for multiple purposes. In addition, it is possible to improve the productivity of the process increases the accuracy of the PCB strip for fine solder ball.