PROBE CONTACT FOR BGA PACKAGE TEST SOCKET AND BGA PACKAGE TEST SOCKET INCLUDING THE SAME

摘要

The present invention relates to a BGA package includes a probe test socket for BGA package, contact them and test sockets, In particular, in the BGA package and the test probe contacts the ball test sockets for BGA package for electrically connecting the electrode of the board, the BGA package and the contact portion of the ball of the probe contact the test socket for a BGA package which comprises a conductive elastic member relates to a probe contact. ; to minimize damage to the external connection through which the ball of the BGA package, and can maintain a low inductance structure for high frequency response, reduced according to the degradation problem of the elastic force of the elastic member There is an advantage to prevent.