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METHOD TO CONTROL A CRYSTALLIZATION BEHAVIOR FOR LOW TEMPERATURE-PROCESSED AND SOLUTION-PROCESSABLE OXIDE SEMICONDUCTOR

机译:控制低温和溶液可加工氧化物半导体的结晶行为的方法

摘要

PURPOSE: A method for controlling crystallization for an oxide semiconductor for a solution process at a low temperature is provided to promote crystallization by controlling the thickness of a thin film. CONSTITUTION: A metal oxide precursor solution is coated on a substrate with the thickness of a thin film between 1 and 10 nm. The coated thin film is processed at a temperature of 200 to 350 degrees. The diluted solutions of the metal oxide precursor are made to control the thickness of the thin film between 1 and 10 nm by the coating of the metal oxide precursor solution. The diluted solutions of the metal oxide precursor include the metal oxide precursor of 0.01 to 0.09M.
机译:目的:提供一种用于控制低温下用于溶液工艺的氧化物半导体的结晶的方法,以通过控制薄膜的厚度来促进结晶。组成:金属氧化物前驱体溶液以1到10 nm的薄膜厚度涂覆在基板上。涂覆的薄膜在200至350度的温度下加工。通过涂覆金属氧化物前体溶液,制备金属氧化物前体的稀释溶液以将薄膜的厚度控制在1至10nm之间。金属氧化物前体的稀释溶液包括0.01至0.09M的金属氧化物前体。

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