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Method to control a crystallization behavior for low temperature-processed and solution-processable oxide semiconductor

机译:控制低温处理和可溶液处理的氧化物半导体的结晶行为的方法

摘要

The present invention provides a method for producing a crystalline oxide semiconductor,;Coating a metal oxide precursor solution on a substrate with a thin film thickness of 1 to 10 nm or less; And;Low temperature heat treatment of the coated thin film at a temperature of 200 to 350 ° C;;It relates to a method for manufacturing a low temperature crystalline oxide semiconductor comprising a.;The present invention is characterized by promoting the crystallization by controlling the thickness of the thin film.;More specifically, there is an advantage of manufacturing an oxide semiconductor having a crystal phase through low temperature heat treatment, there is an advantage that the crystallization can be controlled by a simple process without going through a catalyst or ultraviolet light and other processes for promoting the crystallization reaction.;Low temperature process, solution process, oxide semiconductor, crystallization
机译:本发明提供了一种用于制造晶体氧化物半导体的方法;将金属氧化物前体溶液涂覆在薄膜厚度为1至10nm或更小的基板上;并且;在200至350℃的温度下对所述涂覆的薄膜进行低温热处理;;涉及一种制造包含a的低温结晶氧化物半导体的方法;本发明的特征在于通过控制结晶来促进结晶。更具体地说,具有通过低温热处理来制造具有晶相的氧化物半导体的优点,具有可以通过简单的工艺控制结晶而无需通过催化剂或催化剂的优点。紫外线和其他促进结晶反应的过程。低温过程,溶液过程,氧化物半导体,结晶

著录项

  • 公开/公告号KR101069613B1

    专利类型

  • 公开/公告日2011-10-05

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20090083346

  • 发明设计人 정선호;최영민;류병환;

    申请日2009-09-04

  • 分类号H01L21/208;H01L21/324;

  • 国家 KR

  • 入库时间 2022-08-21 17:49:42

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