SPUTTERING APPARATUS WITH A DUAL CHAMBER, INCLUDING A SUBSTRATE CHAMBER, A MAGNETRON CHAMBER, A SPUTTERING TARGET, AND A PRESSURE CONTROLLER

摘要

PURPOSE: A sputtering apparatus with a dual chamber is provided to save necessary energy for pressure adjustment by the reduction in a space which a pressure controller processes.;CONSTITUTION: A sputtering apparatus with a dual chamber comprises a substrate chamber(204), a magnetron chamber(202), a sputtering target(270), and a pressure controller(290). The substrate is loaded into the substrate chamber. The magnetron is installed in the magnetron chamber. The sputtering target is formed between the substrate chamber and the magnetron chamber. The pressure controller adjusts the pressure of the magnetron chamber differently.;COPYRIGHT KIPO 2011