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Regulation of Substrate-Target Distance on the Microstructural Optical and Electrical Properties of CdTe Films by Magnetron Sputtering

机译:磁控溅射对CdTe薄膜微结构光学和电学性质的基靶距离调节

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摘要

Cadmium telluride (CdTe) films were deposited on glass substrates by direct current (DC) magnetron sputtering, and the effect of substrate-target distance (Dts) on properties of the CdTe films was investigated by observations of X-ray diffraction (XRD) patterns, atomic force microscopy (AFM), UV-VIS spectra, optical microscopy, and the Hall-effect measurement system. XRD analysis indicated that all samples exhibited a preferred orientation along the (111) plane, corresponding to the zinc blende structure, and films prepared using Dts of 4 cm demonstrated better crystallinity than the others. AFM studies revealed that surface morphologies of the CdTe films were strongly dependent on Dts, and revealed a large average grain size of 35.25 nm and a high root mean square (RMS) roughness value of 9.66 nm for films fabricated using Dts of 4 cm. UV-VIS spectra suggested the energy band gap (Eg) initially decreased from 1.5 to 1.45 eV, then increased to 1.68 eV as Dts increased from 3.5 to 5 cm. The Hall-effect measurement system revealed that CdTe films prepared with a Dts of 4 cm exhibited optimal electrical properties, and the resistivity, carrier mobility, and carrier concentration were determined to be 2.3 × 105 Ω∙cm, 6.41 cm2∙V−1∙S−1, and 4.22 × 1012 cm−3, respectively.
机译:通过直流(DC)磁控溅射在玻璃基板上沉积碲化镉(CdTe)膜,并通过观察X射线衍射(XRD)图案研究了基板目标距离(Dts)对CdTe膜性能的影响。 ,原子力显微镜(AFM),UV-VIS光谱,光学显微镜和霍尔效应测量系统。 XRD分析表明,所有样品均沿(111)面表现出优选的取向,对应于锌共混物结构,并且使用4cm Dts制备的膜显示出比其他膜更好的结晶度。 AFM研究表明,CdTe膜的表面形态强烈依赖于Dts,并且对于使用4 cm Dts制造的膜,其平均晶粒尺寸为35.25 nm,且均方根(RMS)粗糙度值较高,为9.66 nm。 UV-VIS光谱表明,能带隙(Eg)最初从1.5降低到1.45 eV,然后随着Dts从3.5厘米增加到5厘米而增加到1.68 eV。霍尔效应测量系统表明,以4 cm Dts制备的CdTe膜表现出最佳的电性能,确定的电阻率,载流子迁移率和载流子浓度为2.3×10 5 Ω∙cm ,6.41 cm 2 ∙V −1 ∙S −1 和4.22×10 12 cm -3

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