Preventing litter vapor coatings during sputtering of target, comprises moving substrate through plasma produced by magnetron in vacuum of process chamber, and introducing process gas for sputtering material of targets into process chamber

摘要

The method comprises moving a substrate, in a vacuum of a process chamber (4), through a plasma produced by a magnetron (5), and introducing a process gas for sputtering a material of targets connected with the magnetron into the process chamber. The process gas is supplied to a vicinity of the substrate and to a gas flow directed toward an internal space of the process chamber. The process gas is supplied to a substrate inlet along the substrate in a transport direction and to a substrate outlet (10) along the substrate opposite to the transport direction. The method comprises moving a substrate, in a vacuum of a process chamber (4), through plasma produced by a magnetron (5), and introducing a process gas for sputtering a material of targets connected with the magnetron into the process chamber. The process gas is supplied to a vicinity of the substrate and to a gas flow directed toward an internal space of the process chamber. The process gas is supplied to a substrate inlet along the substrate in a transport direction and to a substrate outlet (10) along the substrate opposite to the transport direction. A reactive gas is introduced in a mixture together with a working gas. An independent claim is included for an arrangement for preventing litter vapor coatings during sputtering of a target with a magnetron lying transverse to a transport direction of a substrate in a process chamber.