METHOD FOR FORMING FINE CIRCUIT STRUCTURE USING CONTROLLING RESIDUAL STRESS AND METHOD FOR FORMING PRINTED CIRCUIT BOARD USING THEREOF

摘要

PURPOSE: A method for forming a micro circuit pattern through a residual stress control and a printed circuit board using the same are provided to improve yield and obtain high density by implementing a high etching factor. CONSTITUTION: A first copper foil layer is formed on the upper side of an insulation substrate. The residual stress of a copper layer is offset by applying a tensile force to a copper foil layer before the copper foil layer is etched(S300). A circuit pattern is formed by etching the first copper foil layer and a via hole is formed on the insulation layer by a drill process(S220). A second copper foil layer is formed on the surface of the first copper layer and the inner surface of the via hole by a plating process(S230). The residual stress of the second copper foil layer is offset by applying the tensile force to the second copper foil layer. A micro circuit pattern is formed by etching the first and second copper foil layers.