METHOD FOR FORMING FINE CIRCUIT STRUCTURE USING CONTROLLING RESIDUAL STRESS AND METHOD FOR FORMING PRINTED CIRCUIT BOARD USING THEREOF

摘要

The present invention relates to a method for forming a fine circuit pattern and a method for forming a printed circuit board using the same, wherein a tensile force is applied to a copper clad laminate (CCL) including a copper foil layer to a residual stress '0' of the copper foil layer. By controlling to close, the invention relates to a high etching factor (High Etching Factor) at the time of forming the circuit pattern, and thereby to a high density of the printed circuit board and to improve the manufacturing yield.