STACKED CHIP PACKAGE USING A TSV CAPABLE OF INCREASING THE RELIABLITY AND YIELD OF AN ACTIVE CHIP

摘要

PURPOSE: A stacked chip package using a TSV is provided to combine heat emitting devices with chips, thereby maximizing emission of heat generated in each chip.;CONSTITUTION: A TSV(Through Silicon Via)(304) is formed in a plurality of semiconductor chips(302a~302n). The TSV is stacked on a substrate(300). A silicon interposer(308) is inserted between stacked chips. A heat slug(310) comprises a plurality of legs(312) which is supported in the edge upper surface of the interposer. The heat generated in the semiconductor chip is easily emitted to the outside via the silicon interposer and the heat slug.;COPYRIGHT KIPO 2011