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ETCHING METHOD, A METHOD FOR MANUFACTURING A FINE STRUCTURE, AND AN ETCHING DEVICE FOR REMOVING A METAL LAYER USED IN A DIFFUSION PROCESS

机译:刻蚀方法,精细结构的制造方法以及用于去除扩散工艺中使用的金属层的刻蚀装置

摘要

PURPOSE: An etching method, a method for manufacturing a fine structure, and an etching device are provided to stripe a resist attached to a silicon wafer by using oxide materials generated through the electrolysis of aqueous solutions of sulfuric acid. ;CONSTITUTION: A sulfuric acid electrolysis unit(10) generates etching solutions with oxide materials and includes an anode(32), a cathode(42), a diaphragm(20), and a cathode chamber(40). An etching unit(12) etches a substrate(W) by using solutions with oxide materials generated from the sulfuric acid electrolysis unit. An etchant supply unit(14) supplies the etchant to the etching unit. A nozzle(61) includes an outlet for spraying the etchant to the substrate.;COPYRIGHT KIPO 2011
机译:目的:提供一种蚀刻方法,一种用于制造精细结构的方法以及一种蚀刻装置,以通过使用由硫酸水溶液的电解产生的氧化物来剥离附着在硅晶片上的抗蚀剂。组成:硫酸电解装置(10)用氧化物材料产生蚀刻溶液,并包括阳极(32),阴极(42),隔膜(20)和阴极室(40)。蚀刻单元(12)通过使用具有由硫酸电解单元产生的氧化物材料的溶液来蚀刻基板(W)。蚀刻剂供应单元(14)将蚀刻剂供应到蚀刻单元。喷嘴(61)包括用于将蚀刻剂喷射到基板上的出口。; COPYRIGHT KIPO 2011

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