MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILAYER WIRING SUBSTRATE CAPABLE OF PROPERLY SETTING THE SURFACE ROUGHNESS OF THE OUTERMOST LAYER THEREOF

摘要

PURPOSE: A multilayer wiring substrate and a method of manufacturing multilayer wiring substrate are provided to implement a desmear process after a build up process, thereby configuring surface roughness which is appropriate for flux or under fill in regard to the surface of an outermost resin dielectric layer.;CONSTITUTION: An wiring laminate portion(30) is formed by alternatively laminating a conductive layer(26) made of copper and four resin dielectric layers(21~24). A via hole(33) and a field via conductor(34) are formed in the resin dielectric layer, respectively. A plurality of openings(35,36) is formed in a fourth layer of the resin dielectric layers exposed to an outermost layer. The front surface side peripheral part of a IC chip connection terminal(41) is buried within the fourth layer of the resin dielectric layers. An opening(38) exposing a motherboard connection terminal(45) is formed in a solder resist(37).;COPYRIGHT KIPO 2011