SEMICONDUCTOR DEVICE MANUFACTURING METHOD FOR PREVENTING WAFER WARPAGE CAPABLE OF PREVENTING DEFOCUSING AND CHUCKING ERRORS DURING A PROCESS

摘要

PURPOSE: A semiconductor device manufacturing method for preventing wafer warpage is provided to eliminate a rear thin film using dry etching or lateral cleaning or form a dummy film on the frontal film of a wafer and eliminate the rear thin film, thereby preventing chucking errors during defocusing and depositing processes of a light exposure process. ;CONSTITUTION: A frontal thin film and a rear thin film are formed on a wafer(101). A dummy film is formed on the frontal thin film. A rear thin film is eliminated. The dummy film includes a film with tensile stress. The dummy film includes a nitride film by a plasma chemical vapor deposition method.;COPYRIGHT KIPO 2011