NON-ELECTROLYTIC CO-W-P TERNARY ALLOY PLATING LIQUID, A NON-ELECTROLYTIC PLATING PROCESS USING THE SAME, AND A CO-W-P TERNARY ALLOY COATING FILM FORMED BY THE SAME

摘要

PURPOSE: A non-electrolytic Co-W-P ternary alloy plating liquid, a non-electrolytic plating process using the same, and a Co-W-P ternary alloy coating film formed by the same are provided to form a coating film with superior thermal stability and reliability by alloying Co and W having high melting points.;CONSTITUTION: A non-electrolytic Co-W-P ternary alloy plating liquid comprises cobalt acetate or cobalt sulfate, ammonium tungstate, sodium hypophosphite, and an additive. The concentration of the cobalt acetate or the cobalt sulfate is 10~20 g/l, the ammonium tungstate 5~10 g/l, and the sodium hypophosphite 20~40 g/l. The additive is composed of metal salt including one of Sn, Zn, Mg, Pb, and Cd, NaSCN, KSCN, and their mixture.;COPYRIGHT KIPO 2011