NICKEL-PHOSPHORUS-TUNGSTEN TERNARY ALLOY ELECTROLESS PLATING SOLUTION, ELECTROLESS PLATING PROCESS USING SAME, AND NICKEL-PHOSPHORUS-TUNGSTEN TERNARY ALLOY FILM PRODUCED BY SAME

摘要

The present invention relates to a nickel-phosphorus-tungsten ternary alloy electroless plating solution, to an electroless plating process using same, and to a nickel-phosphorus-tungsten ternary alloy film produced by same. The electroless plating process according to the present invention is performed at a low temperature and in neutral pH conditions, to thereby reduce the chemical erosion or modification to other materials during the selective formation of the plated film. The nickel-phosphorus-tungsten ternary alloy electroless plating solution according to the present invention uses tungsten, which is a high fusion point metal, to prevent the diffusion of copper in the plated film and to achieve improved thermal stability, and can thus be useful in a variety of semiconductors, packages, and printed circuit boards.