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process of electroless plating Cu-Sn-Zn ternary alloy

机译:化学镀Cu-Sn-Zn三元合金的工艺

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Cu-Sn-Zn ternary alloy layer with 10 urn thickness was prepared through electroless plating method. The influences of process conditions including the concentration of metallic salts, reductant and complex agent on Cu-Sn-Zn alloy were studied in details. The stability to bear color changes and corrosion resistance of Cu-Sn-Zn film layer were studied through air-exposure experiment and electrochemical analyses test respectively. The results show that the performances of Cu-Sn-Zn film layer are obviously superior to brass matrix. By use of SEM, EDS and XRD, the morphology, microstructure and chemical composition were investigated. The results show that complex agent can increase the content of Sn and Zn, improve the evenness and compactness and decrease needle holes, therefore the properties of electroless plating layer such as the stability to bear color changes and corrosion resistance are improved remarkably. The probable mechanism of complex agent was discussed.
机译:采用化学镀法制备了厚度为10 n的Cu-Sn-Zn三元合金层。详细研究了金属盐,还原剂和络合剂等工艺条件对Cu-Sn-Zn合金的影响。通过空气暴露实验和电化学分析试验研究了Cu-Sn-Zn膜层的耐变色稳定性和耐蚀性。结果表明,Cu-Sn-Zn膜层的性能明显优于黄铜基体。利用SEM,EDS和XRD对材料的形貌,微观结构和化学成分进行了研究。结果表明,络合剂能增加锡,锌的含量,提高均匀度和致密性,减少针孔,因此化学镀层的耐变色稳定性和耐蚀性等性能得到显着改善。讨论了复合剂的可能机理。

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