POWER PACKAGE MODULE AND A FABRICATING METHOD THE SAME, CAPABLE OF PREVENTING THE CRACK OF A SOLDER CONNECTING A BASE SUBSTRATE AND A CHIP MOUNTING SUBSTRATE

摘要

PURPOSE: A power package module and a fabricating method the same are provided to prevent the crack of a second bonding layer between a base substrate and an anode oxide substrate by using an anode oxide substrate of low coefficient of thermal expansion as a chip mounting substrate.;CONSTITUTION: A power package module and a fabricating method the same comprise: a base substrate(110); an anode oxide substrate(120) which is formed by a first metal layer, a anode oxide layer, a pattern layer, and a second metal layer which is connected to the base substrate; and high power chip and a low power chip(130,131) which are formed in the anode oxide substrate and are electrically connected to the pattern layer.;COPYRIGHT KIPO 2011