Substrate Requirements for Effective Integration of Chip Scale Packages and Multichip Modules in Portable Wireless Products

摘要

The trend in portable wireless products such as two-way radios and cellular phones is to design products with reduced size and increased functionality. This product trend has impacted the components and substrates which make up the functional building blocks of these prod- ucts. Cellular phones and two-way radios typically have three main functional blocks; digital control or logic, radio frequency (RF), and user interface. Advances in silicon ontegration, discrete component manufacturing, and Integrated Circuit (IC) Packa ging technologies have enabled significant size and functionality improvements in both the logic and RF blocks.