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ARC DETECTION APPARATUS CAPABLE OF REDUCING THE FAILURE RATE OF A WAFER ETCHING PROCESS CAUSED BY ABNORMAL PLASMA STATE
ARC DETECTION APPARATUS CAPABLE OF REDUCING THE FAILURE RATE OF A WAFER ETCHING PROCESS CAUSED BY ABNORMAL PLASMA STATE
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机译:能够减少异常等离子体状态引起的晶圆刻蚀过程的故障率的电弧检测装置
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摘要
PURPOSE: An arc detection apparatus is provided to immediately and sensitively check the internal state of a processing chamber, thereby monitoring the abnormality of plasma in the processing chamber in real time.;CONSTITUTION: An arc detection apparatus comprises an RGB sensor unit(200), a master board(300), an analog to digital converter(231), a color analysis unit(236) and a comparison unit(237). The RGB sensor unit comprises an RGB module(230) which measures the light generated from plasma in a plasma processing chamber. The master board processes signals outputted from the RGB sensor unit and controls the operation of the processing chamber or displays the processing state to outside. The analog to digital converter changes RGB signals detected by the RGB sensor unit into digital signals. The color analysis unit changes the plasma state into numerically quantized RGB optical data. The comparison unit compares RGB optical data transmitted from the color analysis unit with the RGB optical data obtained from the plasma of steady state.;COPYRIGHT KIPO 2011
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