Metal bump formation method on semiconductor connection pad

摘要

A method for forming metal bumps on a semiconductor connection pads is provided to secure firm connection between the semiconductor connection pad and a metal pump by using the adhesion of the metal and an insulating adhesive layer. A semiconductor device(10) is provided. The semiconductor device includes a connection pad(12). A UBM(Under Bump Metallurgy)(16) is formed on the connection pad of the semiconductor device. A metal foil(20) and an insulating adhesive layer(18) are formed on the semiconductor device including the UBM. The metallic foil and the insulation adhesion layer are removed from the UBM. A hole is formed in order to expose the UBM. An electroless metal layer(24) is formed in the wall of the hole. A resistance film is formed on the metallic foil. The resistance film does not cover the hole. The conduction current flows to the UBM through the metallic foil and the electroless metal layer. The metal bump(28) is formed on the UBM. The resistance film and the metallic foil are removed.