SUBSTRATE FOR SEMICONDUCTOR PACKAGE WITH BUMPS, SEMICONDUCTOR PACKAGE FABRICATED BY USING THE SAME AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE WITH BUMPS TO PRECISELY FORM UPPER SURFACES OF CONNECTION PORTIONS OF SUBSTRATE FOR SEMICONDUCTOR PACKAGE WITHOUT ADDITIONAL LEAD BOND PADS

摘要

PURPOSE: A substrate for a semiconductor package with bumps is provided to precisely form upper surfaces of connection portions of a substrate for a semiconductor package without additional lead bond pads by making the upper surfaces of the connection portions function as lead bond pads. CONSTITUTION: Die bond pads(722) formed on the lower surface of a die(721) having a semiconductor circuit are interconnected and taken out in a substrate for a semiconductor package. Connection portions correspondingly connected to the die bond pads are formed by an etch process, and leads(712) that are connected to the respective connection portions to be taken out are formed in a conductive thin plate(71p). An insulator is filled in the etched spaces of the conductive thin plate.