METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE WITH SIDEWALL JUNCTION CAPABLE OF PREVENTING A FLOATING BODY DUE TO THE EXCESSIVE DIFFUSION OF SIDEWALL JUNCTION

摘要

PURPOSE: A method for manufacturing a semiconductor device with sidewall junction is provided to reduce development costs by simplifying manufacturing processes by forming sidewall contact and sidewall junction during etching a trench which is processed two times.;CONSTITUTION: A substrate(21B) is etched and a plurality of bodies, which is separated with a first trench(24), is formed. Junction is formed in the substrate on the bottom side of the first trench. A part of the junction is etched and sidewall junction(29A), whose side is exposed by a second trench, is formed. A metal bit line(33), which fills the second trench while being connected to the sidewall junction, is formed.;COPYRIGHT KIPO 2012