DEVICE FOR NON-DESTRUCTIVE thickness measurement of dielectric and semiconductor films

摘要

The proposed utility model relates to measuring equipment and is designed to quickly measure the thickness of the solid and liquid dielectric and semiconductor films and coatings in the range of 10 micron - 1 mm and can be used in producing films and research.; The object of the proposed utility model is to increase the measurement performance of the interferometric film thickness measurement (layers), by providing the possibility of measuring the thickness of a few predetermined points at high speed.; To solve the problem of the device to enter two additional lenses and a rotating flat mirror.