DEVICE FOR NON-DESTRUCTIVE thickness measurement of dielectric and semiconductor films

摘要

The invention relates to measuring equipment and is designed for quick and highly accurate measurement of the thickness of the solid and liquid dielectric and semiconductor films and coatings in the thickness range from 10 micrometers to 1 mm and can be used in the manufacturing process control films production and research.; An apparatus for the nondestructive measurement of the thickness of the dielectric and semiconductor films containing a source of monochromatic radiation, a sample holder, a rotating flat mirror, the axis of rotation which is located on its reflective surface and a radiation receiver which is connected to the recording apparatus, the first spherical mirror mounted so that the point optically conjugate to the sample point at which the measurements are made, it is on the rotational axis of the flat mirror in place of the radiation falling on it Source and a second spherical mirror mounted to the optical conjugation of the sample point at which the measurements are made, and a receiving area of ​​the radiation receiver, for different angular positions of the plane mirror, characterized in that the device further comprises an electro-optical marker, without interrupting the fall of the laser beam on the sample at a fixed angle, consisting of an additional laser and photodetector of the additional laser.