Solder mask for wave soldering method and method for selectively soldering of individual components of a printed circuit board in a wave soldering machine -

摘要

The invention relates to a soldering mask for wave soldering method and method for selectively soldering of individual components of a printed circuit board. The solder mask (34) in this case serves for receiving and holding a printed circuit board (10), whose underside (14) in a wave soldering areas - vending machine is to be soldered.The solder mask (34) has, for this purpose, at least a partial heat transfer zone has (40), by means of which the heat of the solder wave (42) indirectly to a on a top side (12) of the printed circuit board (10) of the soldering point (20, 26) with solder deposit (28) and / or a there to solder end component (32) is conducted.