Soldering mask for wave soldering and method for selective soldering of individual components of a circuit board in a wave soldering machine

摘要

The mask (34) has a cover (36) for protecting surface mounted device (SMD)-components (16) that are soldered on a lower side (14) of a printed circuit board (10). A partial heat transmission zone (40) indirectly conducts heat of solder waves (42) to soldering points (20) of the printed circuit board with a solder deposit (28) and/or a through-hole technology (THT) component (32) to be soldered. The heat transmission zone is arranged in a region of a window (38), and is made of a metallic coating of the mask, where the mask is partially produced from a heat conductive material. An independent claim is also included for a method for assembling and soldering components on a printed circuit board.