Method and wave soldering system for soldering components on the top and bottom of a printed circuit board

摘要

In previously known Wellenlötanlagen components or pins are soldered to a bottom of printed circuit boards, which is run over by a solder wave of liquid solder. In order to simultaneously solder components (26) on the upper side and components (42) or pins on the underside (40) of printed circuit boards (10) in the wave soldering system (50), according to the invention the transport speed of the printed circuit boards (10) through the Wave soldering system (50) adjusted such that a heat transfer from the solder wave (60) through the printed circuit boards (10) on the solder wave (60) top of the printed circuit boards (10), so that there in solder paste (24) inserted components (26 ) can be soldered. The solder wave (60) covers the underside (40) of the printed circuit boards (10) and soldered there in a known manner. The said printed circuit boards (10) are for this purpose transported substantially horizontally and without usual angle of attack over the solder wave (60).