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Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink
Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink
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机译:结合了冶金学键以增强到散热器的热传导的集成电路器件
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摘要
An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a package substrate includes an inner region and a peripheral region. The integrated circuit die is positioned over the substrate surface and a first surface of the integrated circuit die is placed in contact with the package substrate. A metallic layer is formed on a second opposing surface of the integrated circuit die. A preform is positioned on the metallic layer and a heat sink is positioned over the preform. A joint layer is formed with the preform, metallurgically bonding the heat sink to the second surface of the integrated circuit die.
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