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Non-contact type signal transmission device and non-contact type signal transmission method

机译:非接触式信号传输装置和非接触式信号传输方法

摘要

PROBLEM TO BE SOLVED: To provide a noncontact type signal transmission device and method that can be adapted to micronizing of electrodes and achieve high-speed transmission and long-distance transmission of electric signals between remote chips and boards.;SOLUTION: A voltage signal can be detected in a noncontact state by a detecting device having a first electrode 3a provided on a semiconductor package 5 or integrated circuit chip, a second electrode 3b provided on a packaging substrate 6 and disposed nearby the first electrode 3a, an optoelectric field element 1 disposed between the first electrode 3a and second electrode 3b, an optical transmission line 2 connected to the optoelectric field element 1, a light incidence means 31 of making light incident on the optoelectric field element 1 from the other side of the optical transmission line 2, and an optical detecting means 41 of detecting light reflected in the optoelectric field element 1.;COPYRIGHT: (C)2009,JPO&INPIT
机译:要解决的问题:提供一种非接触型信号传输装置和方法,该装置和方法可适用于电极的微粉化,并实现远程芯片和板之间电信号的高速传输和长距离传输。通过检测装置以非接触状态进行检测,该检测装置具有设置在半导体封装5或集成电路芯片上的第一电极3a,设置在封装基板6上并设置在第一电极3a附近的第二电极3b,光电电场元件1在第一电极3a和第二电极3b之间,连接到光电场元件1的光传输线2,使光从光传输线2的另一侧入射到光电场元件1上的光入射装置31,和光学检测装置41,用于检测在光电场元件1中反射的光。版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP5050598B2

    专利类型

  • 公开/公告日2012-10-17

    原文格式PDF

  • 申请/专利权人 日本電気株式会社;

    申请/专利号JP20070075800

  • 发明设计人 増田 則夫;

    申请日2007-03-23

  • 分类号G02F1/03;

  • 国家 JP

  • 入库时间 2022-08-21 17:42:17

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