MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR GLUED WAFER

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device for a glued wafer which can easily remove only oxide film residue while leaving an oxide film on a wafer for a support substrate.;SOLUTION: A manufacturing method for a glued wafer comprises: a gluing process of gluing a wafer for an active layer and a wafer for a support substrate through an oxide film to form a composite wafer; a heat treatment process of performing a heat treatment on the composite wafer and of strengthening the adhesion of the glued surfaces; a trimming process of beveling the outer peripheral part of the wafer for an active layer after the heat treatment; an etching process of etching the outer peripheral part of the beveled wafer for an active layer and for exposing the outer peripheral part of the oxide film of the wafer for an active layer; an oxide film removal process of attaching an adhesive tape on the outer peripheral part of the oxide film, and then peeling the adhesive tape, and removing a part of the oxide film. A manufacturing device for a glued wafer comprises: tape attachment means for attaching an adhesive tape on the outer peripheral part of the oxide film; tape peeling means for removing the oxide film by peeling the adhesive tape.;COPYRIGHT: (C)2012,JPO&INPIT