METHOD OF MANUFACTURING RESIN MOLDING TERMINAL FOR ELECTRONIC COMPONENT, RESIN MOLDING TERMINAL FOR ELECTRONIC COMPONENT MANUFACTURED BY THE METHOD, COMPONENT STRUCTURE THEREOF, AND METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE USING RESIN MOLDING TERMINAL

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin molding terminal for an electronic component, an resin molding terminal for an electronic component manufactured by the method, a component structure thereof, and a method of manufacturing an optical semiconductor device using the resin molding terminal, capable of resource saving by minimizing the amount of material required for manufacture to reduce member material that is wasted, and capable of reducing cost and improving mass productivity by simplifying a manufacturing process.;SOLUTION: The method of manufacturing a resin molding terminal for an electronic component includes: a step for forming a mounting part of an electronic component and a junction part for electrically connecting with the electronic component using a round or square conductor wire by press working, header working, or swaged molding working, with them being separated from each other; a step for simultaneously arranging, in a metal mold, respective conductor wires where the mounting part of the electronic component and the junction part are formed; and a step for providing, by resin molding, a frame material for forming a hollow structure in which the electric component mounted on the mounting part and the junction part are contained.;COPYRIGHT: (C)2012,JPO&INPIT