METHOD OF MANUFACTURING EPOXY RESIN MOLDING MATERIAL FOR SEALING SEMICONDUCTOR, EPOXY RESIN MOLDING MATERIAL FOR SEALING SEMICONDUCTOR, AND ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing epoxy resin molding material for sealing a semiconductor with less metal abrasion powder of a kneading device mixed; and to provide the epoxy resin molding material for sealing a semiconductor obtained by the same manufacturing method, and an electronic component device using an epoxy resin composition.SOLUTION: The method of manufacturing the epoxy resin molding material for sealing a semiconductor includes: a mixing process of mixing raw material including epoxy resin, a curing agent, and an inorganic filler uniformly; a vibrating and heating process having a vibration feeder 2 for conveying and vibrating a mixture 1 obtained in the mixing process, and a near-infrared heater 3 for irradiating with a near-infrared ray and heating; a kneading process of kneading the mixture via the vibrating and heating process to form a kneaded material; a rolling process of rolling the kneaded material obtained in the kneading process in a sheet shape by a mill roll; a cooling process of cooling the kneaded material rolled in the rolling process in gas while conveying by a cooling conveyer; a crushing process of crushing the rolled kneaded material cooled in the cooling process by a crusher; and a molding process of compression-molding a crushed product obtained in the crushing process.