COMPRESSION-MOLDING APPARATUS DEVICE FOR MANUFACTURING RESIN-SEALED COMPONENT COMPRESSION-MOLDING METHOD AND METHOD FOR MANUFACTURING RESIN-SEALED COMPONENT

摘要

A compression molding apparatus capable of compression molding both sides of a substrate efficiently without using a release film is provided. At least a part of the upper surface of the lower mold half member 220 constitutes the bottom surface of the lower mold cavity 201 and the lower mold half member 220 has a lower mold half At least a part of the inner side surface constitutes the side surface of the lower mold cavity 201 and the lower surface of the substrate 1 disposed between the two cavities 201 and the upper mold cavity 131 are compression- And the lower mold half member 220 and the lower mold side member 230 are raised and lowered separately so that the resin encapsulation product 1B obtained by resin sealing of the substrate 1 is released from the lower mold cavity 201, (1B) is released from the upper mold cavity (131) by projecting the ejector pin (143) from the upper surface of the upper mold (131).