COMPRESSION-MOLDING APPARATUS DEVICE FOR MANUFACTURING RESIN-SEALED COMPONENT COMPRESSION-MOLDING METHOD AND METHOD FOR MANUFACTURING RESIN-SEALED COMPONENT

摘要

Provided is a compression molding device which is capable of efficiently compression molding both surfaces of a substrate without using a release film. The compression molding device of the present invention comprises a forming mold (10) including an upper mold (100) and a lower mold (200), wherein at least a portion of a top surface of a lower mold bottom surface member (220) forms a bottom surface of a lower mold cavity (201); at least a portion of an inner surface of a lower mold side surface member (230) forms a side surface of the lower mold cavity (201); the both surfaces of the substrate (1) disposed between both of the cavities are resin-sealed through compression molding by the lower mold cavity (201) and an upper mold cavity (131); the lower mold bottom surface member (220) and lower mold side surface member (230) are each separately ascended and descended to release a resin-sealed product (1B) obtained by resin-sealing the substrate (1) from the lower mold cavity (201); and an ejector pin (143) is protruded from a top surface of the upper mold cavity (131) to release the resin-sealed product (1B) from the upper mold cavity (131).