首页> 外国专利> PROTECTIVE FILM FOR FPC, RESIN CONDUCTOR FOIL LAMINATE WITH PROTECTIVE FILM FOR FPC, AND METHOD OF MANUFACTURING FLEXIBLE PRINTED WIRING BOARD USING IT

PROTECTIVE FILM FOR FPC, RESIN CONDUCTOR FOIL LAMINATE WITH PROTECTIVE FILM FOR FPC, AND METHOD OF MANUFACTURING FLEXIBLE PRINTED WIRING BOARD USING IT

机译:用于fpc的保护膜,带有用于fpc的保护膜的树脂导体箔片以及使用其制造柔性印刷线路板的方法

摘要

PROBLEM TO BE SOLVED: To provide a resin conductor foil laminate which prevents chemical pollution of the resin surface of the resin conductor foil laminate or contamination of the resin surface with a foreign matter or a flaw while ensuring excellent handleability, and to provide a method of manufacturing a flexible printed wiring board capable of simultaneous processing of both sides with high productivity.;SOLUTION: The protective film for FPC has an adhesive layer for sticking a resin layer on one or both sides of a polyethylene terephthalate substrate which has a heat shrinkage rate of 0.5% or less in both length direction and width direction in conditions of 150°C, 30 minutes. The protective film for FPC is stuck detachably to the polyimide resin layer surface of a conductor foil laminate on which a polyimide resin layer is laminated with the adhesive layer for sticking a resin layer interposed therebetween.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种树脂导体箔层压体,其在确保优异的可操作性的同时防止树脂导体箔层压体的树脂表面的化学污染或树脂表面被异物或瑕疵污染,并且提供了一种方法。解决方案:用于FPC的保护膜具有粘合层,该粘合层用于将树脂层粘贴在具有热收缩率的聚对苯二甲酸乙二醇酯基板的一侧或两侧上在150℃,30分钟的条件下,在长度方向和宽度方向上均为0.5%以下。 FPC的保护膜可拆卸地粘贴在层压有聚酰亚胺树脂层的导体箔层压板的聚酰亚胺树脂层表面上,其间夹有用于粘合树脂层的粘合剂层。版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2012028817A

    专利类型

  • 公开/公告日2012-02-09

    原文格式PDF

  • 申请/专利权人 FUJIMORI KOGYO CO LTD;

    申请/专利号JP20110236062

  • 申请日2011-10-27

  • 分类号H05K1/03;B32B27/00;B32B27/34;

  • 国家 JP

  • 入库时间 2022-08-21 17:40:12

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