BALL BOND INSPECTION DEVICE AND BALL BOND INSPECTION METHOD USED FOR THE BALL BOND INSPECTION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a ball bond inspection device and a ball bond inspection method for detecting a feature amount of ball bond from image data created by taking in reflection light from the ball bond without being influenced by a substrate pattern.SOLUTION: Illumination light (incident light i) is irradiated to ball bond 11 by light source of illumination 12, and reflection light j reflected by the ball bond 11 is taken in by a camera 13 so that shading image data vd is generated. At an evaluation value calculation part 15, an evaluation value is calculated from pixel information in a circular or ellipsoidal processing region that is predetermined as having a size less than that of an inspection target. At an evaluation image creation part 16, evaluation value calculation means is executed on any coordinate on the shading image data, so that an evaluation value is arranged to correspond to a coordinate of the processing region for creating an evaluation image. At a black area extraction part 17, continuous black regions with a gray value of a threshold or less are extracted from the evaluation image ve. At a ball feature amount detection part 18, a feature amount of the ball is detected from the black region.