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Feasibility study on bonding quality inspection of microfluidic devices by optical coherence tomography

机译:光学相干断层扫描对微流体装置粘接质量检测的可行性研究

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摘要

This paper reports the feasibility of optical coherence tomography (OCT) technology for inspection of bonding quality of microfluidic devices in manufacturing environments. A compact optical-fiber–based OCT is developed and its measurement performance is characterized. A series of microfluidic devices respectively bonded by adhesive tape, thermal method, and oxygen plasma, are inspected. The defects of geometry deformation and sealing completeness are emphasized during measurements. Based on the inspection results, some discoveries related to the production of microfluidic devices are discussed.
机译:本文报道了光学相干断层扫描(OCT)技术的可行性,用于检查制造环境中微流体装置的粘合质量。开发了一种基于紧凑的光纤的OCT,其测量性能的特征在于。检查了一系列分别通过胶带,热法和氧等离子体粘合的微流体装置。在测量期间强调了几何变形和密封完整性的缺陷。基于检查结果,讨论了与生产微流体装置相关的一些发现。

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