BONDING STATE INSPECTION DEVICE, BONDING STATE INSPECTION METHOD, AND BONDING STATE INSPECTION PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a technique capable of accurately inspecting a bonding state of an electrode even when the electrode has a streaky pattern.;SOLUTION: A bonding state inspection device includes: a pick-up image acquisition part that acquires a pick-up image of an electrode which is crimped with an anisotropic conductive film; a pattern acquisition part that acquires a streaky pattern formed on the electrode; an image processing part that carries out image processing on the pick-up image to relatively increase a change in density in a direction not perpendicular to a direction of the pattern with respect to a change in density in a direction perpendicular to the direction of the pattern; and an inspection unit that inspects a bonding state of the electrode based on a detection result of an indentation in the pick-up image after the image processing.;SELECTED DRAWING: Figure 3;COPYRIGHT: (C)2018,JPO&INPIT