Production manner of the electronic system, the radio communication device and the electronic package device (the device and the manner which the integrated circuit tip/chip which has the antenna which was formed from package lead/read wire the package are done)

摘要

Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.