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Mounting board manufacturing equipment causes and specific method of mounting failure

机译:安装板制造设备的原因及安装失败的具体方法

摘要

PROBLEM TO BE SOLVED: To identify a cause efficiently, without deteriorating the productivity of a substrate as much as possible, when packaging failure occurs.;SOLUTION: In a method of identifying the cause of packaging failure in a packaging line, where a screen printer 2, mounting machines 3-5, and an inspection machine 6 form a line, a packaging place on the substrate, in which the packaging failure is detected in the inspection machine 6 is set to be a target point, and one of the screen printer 2 and the mounting machines 3-5 for working the target point is set as the target machine. After the packaging failure is detected, the image of the target point of a subsequent substrate carried in the target machine is captured, at least at one of periods before and after the work to the point, and the cause of the packaging failure is checked, based on the captured image.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:当发生包装故障时,有效地找出原因,而又不使基材的生产率下降尽可能多。解决方法:一种在丝网印刷机中识别包装线中包装失败的原因的方法参照图2,安装机3-5和检查机6形成一条线,将在检查机6中检测到包装失败的基板上的包装位置设置为目标点,并且丝网印刷机之一如图2所示,将用于加工目标点的安装机3-5设定为目标机。在检测到包装失败之后,至少在作业进行到该点之前和之后的一个时间段,捕获目标机器中携带的后续基板的目标点的图像,并检查包装失败的原因,基于捕获的图像。;版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP4896655B2

    专利类型

  • 公开/公告日2012-03-14

    原文格式PDF

  • 申请/专利权人 ヤマハ発動機株式会社;

    申请/专利号JP20060282813

  • 发明设计人 小林 一裕;尾身 幸治;

    申请日2006-10-17

  • 分类号H05K3/34;H05K13/08;

  • 国家 JP

  • 入库时间 2022-08-21 17:37:30

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