Substrate etching mechanism, the substrate etching method and vacuum process equipment

摘要

Substrate etching mechanism used in the vacuum process apparatus for ionizing the gas introduced to emit electrons into the vacuum chamber, cleaned by etching the substrate placed on the turntable provided in the vacuum chamber The substrate etching mechanism A is provided with a, and the filaments of the plurality of which are connected in parallel with the power lead terminal pair for introducing power to the filament as the electron source, the power lead between a pair of terminals. A plurality of filaments to substrate etching mechanism disposed in a direction perpendicular to the rotational axis in a plane perpendicular to the axis of rotation of the turntable. Vacuum process apparatus using the etching mechanism. Substrate etching method using the substrate etching mechanism, the vacuum process equipment.