首页> 外国专利> The circuit baseplate for fabrication, and, forming processing this, the microwave circuit baseplate null

The circuit baseplate for fabrication, and, forming processing this, the microwave circuit baseplate null

机译:微波电路基板的制造以及成形加工用的电路基板null

摘要

PROBLEM TO BE SOLVED: To provide a circuit board for fabrication in which a circuit pattern is not damaged even by performing three-dimensional fabrication of two directions or more in a drawing and the like, and a waveguide circuit board obtained by fabricating the same.;SOLUTION: There are laminated a first layer (1) of a resin film composed of any one of polyimide, polyetherimide, PET and PEN; a second layer (2) composed of copper and serving as a circuit having a desired pattern; and a third layer (3) of a resin layer composed of any one of polyimide, polyetherimide, PET and PEN. Further, a seed layer is formed on a surface of the first layer (1) or the seed layer and a primer coat is formed, thereby obtaining a circuit board for fabrication in which a bond strength between the first layer (1) and the second layer (2) is 390 N/m or more, and then three-dimensional fabrication is performed by using the circuit board for fabrication, thereby manufacturing the waveguide circuit board.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种即使通过在附图等中进行两个或更多个方向的三维制造也不会损坏电路图案的制造电路板,以及通过制造该电路板而获得的波导电路板。 ;解决方案:层压由聚酰亚胺,聚醚酰亚胺,PET和PEN中的任何一种组成的树脂膜的第一层(1);由铜构成的第二层(2),用作具有所需图案的电路;树脂层的第三层(3)由聚酰亚胺,聚醚酰亚胺,PET和PEN中的任何一种构成。此外,在第一层(1)或种子层的表面上形成种子层,并形成底涂层,从而获得用于制造的电路板,其中第一层(1)与第二层之间的结合强度层(2)为390N / m以上,然后使用该制造用电路板进行三维制造,从而制造波导电路板。版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP4830881B2

    专利类型

  • 公开/公告日2011-12-07

    原文格式PDF

  • 申请/专利权人 住友金属鉱山株式会社;

    申请/专利号JP20070025053

  • 发明设计人 吉田 堪;岡田 浩;

    申请日2007-02-05

  • 分类号H05K3/38;H05K1/02;

  • 国家 JP

  • 入库时间 2022-08-21 17:35:37

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