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FLIP-CHIP PACKAGING FOR DENSE HYBRID INTEGRATION OF ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS
FLIP-CHIP PACKAGING FOR DENSE HYBRID INTEGRATION OF ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS
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机译:倒装芯片封装,用于电光子集成电路的密集混合
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摘要
A chip system and method includes a photonics chip and an electrical integrated circuit (IC) flip-chip coupled to the photonics chip to form an optochip. The IC or the photonics chip includes an array of bond pads for attachment to the other. The optochip has an array of bond pads for subsequent attachment to a carrier where the photonics chip includes an exposed edge to connect with at least one waveguide.
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