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Recessed drift region for HVMOS breakdown improvement

机译:凹陷漂移区,可改善HVMOS击穿

摘要

A high-voltage metal-oxide-semiconductor (HVMOS) device having increased breakdown voltage and methods for forming the same are provided. The HVMOS device includes a semiconductor substrate; a gate dielectric on a surface of the semiconductor substrate; a gate electrode on the gate dielectric; a source/drain region adjacent and horizontally spaced apart from the gate electrode; and a recess in the semiconductor substrate and filled with a dielectric material. The recess is between the gate electrode and the source/drain region, and is horizontally spaced apart from the gate electrode.
机译:提供了一种具有增加的击穿电压的高压金属氧化物半导体(HVMOS)器件及其形成方法。 HVMOS器件包括半导体衬底;和半导体衬底表面上的栅极电介质;栅电介质上的栅电极;与栅电极相邻并水平间隔开的源/漏区;半导体衬底中的凹处并填充有介电材料。凹槽在栅电极和源/漏区之间,并且与栅电极水平间隔开。

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