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High breakdown voltage element and channel manufacturing method in which channel region and drifting region are isolated by insulating film

机译:通过绝缘膜隔离沟道区和漂移区的高击穿电压元件和沟道制造方法

摘要

The present invention relates to a high withstand voltage device and a method of manufacturing the same, in which a channel region and a drifting region are separated by an insulating film for manufacturing a high voltage device of 100 V or more using a silicon semiconductor to improve the operation breakdown voltage and reliability of the device. Use only reverse biased pn junctions to sustain the high voltages applied to the drain at the device, without voltage breakdown against low background voltages inside and outside the device, or, in a more advanced manner, use pn junctions inside the device. An insulating film was used for the outside. In order to improve this problem, the present invention utilizes the insulating film isolation method not only inside the device but also inside the device to form a wall of the insulating film between the channel region and the drift region so that the drift region and the source inside the device are formed. It can prevent the current through (punch through) and junction voltage breakdown between the drift region and the channel region, suppress the occurrence of leakage current flowing from the drain to the source, and effectively block the flow to increase the operating breakdown voltage and reliability of the device. I would have to.
机译:高耐压器件及其制造方法技术领域本发明涉及一种高耐压器件及其制造方法,其中,通过绝缘膜将沟道区和漂移区分开,以使用硅半导体来制造100V以上的高电压器件。器件的工作击穿电压和可靠性。仅使用反向偏置的pn结来维持施加到器件漏极的高电压,而不会因器件内部和外部的低本底电压而击穿电压,或者以更高级的方式使用器件内部的pn结。绝缘膜用于外部。为了改善该问题,本发明不仅在器件内部而且在器件内部利用绝缘膜隔离方法在沟道区域和漂移区域之间形成绝缘膜的壁,从而漂移区域和源极在设备内部形成。它可以防止漂移区和沟道区之间的电流通过(穿通)和结电压击穿,抑制从漏极流向源极的泄漏电流的发生,并有效地阻止流过,从而提高了工作击穿电压和可靠性设备的我一定要

著录项

  • 公开/公告号KR19980035946A

    专利类型

  • 公开/公告日1998-08-05

    原文格式PDF

  • 申请/专利权人 양승택;

    申请/专利号KR19960054404

  • 发明设计人 강진영;구진근;곽명신;

    申请日1996-11-15

  • 分类号H01L29/78;

  • 国家 KR

  • 入库时间 2022-08-22 02:48:15

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